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Die Bonding Operator

Aliases: Die Bonding Operator, Die Attach Operator

Industry/Sector(s): Electronics and HW


JOB DESCRIPTION 1
The tasks a Wire  Bonding Operator is expected to perform include:
  • Attaching the silicon die or micro-chip on a lead frame or PCB, respectively
  • Operating the automated pick-and-place machine to solder or paste the silicon die or chip on a lead frame or PCB

 

WORK ENVIRONMENT 

  • It needs one to be on their toes

  • Work from home is not available

  • Part-time and contractual jobs may not be available

  • Local traveling is not a part of this job role

  • Need not handle a team

Working hours
  • Working is 9 hours everyday for 6 days a week
  • Shift system may be applicable

 

Is the job suitable for a candidate with special needs?

Maybe

EDUCATIONAL QUALIFICATIONS AND TRAINING 1

  • Minimum – Preferably 12th standard passed

  • Certified training for Die Bonding Operator (programme aligned to ELE/Q1701 released by Electronics Sector Skills Development Council)

KEY COMPETENCIES 1
  • Proficient in operating the pick-and-place machine
  • Proficient in carrying out preventive maintenance of machine as per manufacturer’s schedule
  • Skilled at maintaining ESD, dust-free and 5S standards as per company’s policy
  • Knowledge of maintaining a safe and healthy working environment at the workplace
  • Proficient at handling hazardous material
  • Knowledge of electrostatic discharge (ESD) measures for electronic component safety

 

DESIRABLE COMPETENCIES 1

  • Knowledge of disposal of hazardous chemicals, tools and materials by following prescribed environmental norms

  • Safety procedures while operating hazardous tools and equipment

AVAILABLE SKILL TRAINING AND LEARNING INSTITUTES 

  • Technical institutes across India

  • ITIs across India

SAMPLE OF TRAINING AND LEARNING COURSES 
CAREER PROGRESSION PATH 


Wire Bonding Operator → Supervisor → Manager

 

Transfer option
  • India: Yes
  • Abroad: Yes

(*This field to open the relevant job title when clicked)

 

EXPECTED EARNINGS 

  • For freshers – ₹ 7,000 to ₹ 9,000 per month

  • For candidates with experience - ₹ 10,000 to ₹ 15,000 per month

(These figures are indicative and subject to change)

REQUIRED WORK EXPERIENCE 1
Not applicable

 

PROBABLE EMPLOYERS 

  • Manufacturing companies

  • Packaging solutions companies

KEYWORDS 
Wire Bonding, Die Attach. Die bonding

 

OCCUPATIONAL CODES AND STANDARDS 
StandardCodeDescription
NCO 20158212.1702Die Bonding Operator
ISCO 20088212 Electrical and Electronic Equipment Assemblers
NIC 200826104Manufacture of bare printed circuit boards, loading of components onto printed circuit boards; manufacture of interface cards (e.g. sound, video, controllers, network, modems)
QP ReferenceELE/Q1701Die Bonding Operator
NSQF4NA
REFERENCES 
1

1 Qualification Pack – Die Bonding Operator

2

http://www.prnewswire.com/news-releases/india-electrical-capacitor-market-to-grow-at-36-until-2019-says-techsci-research-272272931.html

3

3 “Human Resource and Skill Requirements in the IT and ITeS Industry Sector (2022)” released by NSDC

4

www.censusindia.gov.in

5
http://www.nsdcindia.org/sites/default/files/files/Electronics-IT-hardware.pdf
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